- Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
- Supports 1x MXM 3.1 Type A/B form factor GPU module expansion
- 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
- 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
- 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
- 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
- 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
- Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
- Wide operating temperature -40°C to 70°C
GM-1100
Specifications
Front I/O
1 x USB3.2 Gen2 x2 Type C
3 x USB3.2 Gen2 x1
Graphics
Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
Integrated Intel® UHD Graphics 730: Core™ i3
Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
Supports Triple Independent Display
1x DisplayPort Connector (4096 x 2304@60Hz)
*Verified maximum resolution: 3840 x 2160@60Hz
1 x HDMI Connector (4096 x 2160@30Hz)
*Verified maximum resolution: 3840 x 2160@30Hz
1 x VGA Connector (1920 x 1200 @60Hz)
Storage
2x 2.5” Front Accessible SATA HDD/SSD Drive Bay ( SATA3.0 ) (up to 15mm in Height)
1 x M.2 Key M Type 2280 Socket, Support PCIe Gen4 x4 NVMe SSD or SATA SSD (SATA3.0)
1 x M.2 SSD Shared by M.2 Key B Type 3052 Socket, Support PCIe Gen 3x2 NVMe SSD or SATA SSD (SATA3.0)
2 x M.2 SSD Shared by M.2 Key B Type 2242 Socket, Support PCIe Gen 4x2 NVMe SSD or SATA SSD (SATA3.0)
Support RAID 0/1/5/10
Mounting Options
Wall / Side / DIN-RAIL / VESA Mount
Rear I/O
4 x USB3.2 Gen1 x1
• 1x 2.5GbE LAN, RJ45
1 x 1GbE LAN, RJ45
4 x COM
1 x Line-Out
1 x Min-in
Memory Type
DDR5
Supports Un-buered and ECC Type,
Processor Generation
Raptor Lake
Input Voltage
9-48 VDC, Single Power Source
• Power input voltage from 9V to 23V must use dual power connectors, power input voltage from 24V to 48V can use single power connector
Processor
14th Generation Intel® Raptor Lake-S Refresh Series CPU (Coming Soon)
13th Generation Intel® Raptor Lake-S Series CPU:
Intel® Core™ i9-13900E 24 Cores Up to 5.2 GHz, TDP 65W
Intel® Core™ i7-13700E 16 Cores Up to 5.1 GHz, TDP 65W
Intel® Core™ i5-13500E 14 Cores Up to 4.6 GHz, TDP 65W
Intel® Core™ i5-13400E 10 Cores Up to 4.6 GHz, TDP 65W
Intel® Core™ i3-13100E 4 Cores Up to 4.4 GHz, TDP 65W
Intel® Core™ i9-13900TE 24 Cores Up to 5.0 GHz, TDP 35W
Intel® Core™ i7-13700TE 16 Cores Up to 4.8 GHz, TDP 35W
Intel® Core™ i5-13500TE 14 Cores Up to 4.5 GHz, TDP 35W
Intel® Core™ i3-13100TE 4 Cores Up to 4.1 GHz, TDP 35W
12th Generation Intel® Alder Lake-S Series CPU:
Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W
Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W
Operating Temp
• 35W TDP Processor: -40°C to 70°C
• 65W TDP Processor with external FAN: (TBC)
* PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling)
* For GM-1100 + MXM GPU Module operating temperature, please refer to the last page – Operating Temperature Matrix Table for more information (TBC)
* With extended temperature peripherals; Ambient with air flow
* According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
SKU
GM-1100
Accessories
1 x GM-1100 GPU Computer
1 x CPU Heatsink Pack
1 x Screw Pack
2 x Power Terminal Block Connector
1 x Remote Function Terminal Block Connector
2 x External Fan Terminal Block Connector
1 x Wall Mounting Kit
1 x M.2 Key B Type 3052 to 3042 Adapter Bracket
Certifications
EMC:
CE, UKCA, FCC, ICES-003 Class A
EN 50155 (EN 50121-3-2 Only)
E-mark (Pending)
EMI:
CISPR 32 Conducted & Radiated: Class A
EN/BS EN 50121-3-2 Conducted & Radiated: Class A
EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
EN/BS EN 61000-3-3 Voltage fluctuations & flicker
FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
EMS:
EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
EN/IEC 61000-4-5 Surges: AC Power: 2 kV
EN/IEC 61000-4-6 CS: 10V_(**Compliant with the standard when utilizing shielded cable.)
EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz
Dimensions
(WxDxH): 260 x 200 x 85 mm
Memory Capacity
up to 64 GB
LAN Controller
1 x 2.5GbE LAN, RJ45 – Intel® I225
1 x 1GbE LAN, RJ45 - Intel® I219
Expansion
1 x MXM Carrier Board Socket for MXM GPU Module Expansion
1 x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless/Intel CNVi Module Expansion
1 x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen2x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion
2 x M.2 Key B Type 2242 Socket (PCIe Gen 4x2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion
2 x SIM Socket
1 x High Speed CMI Interface for optional CMI Module Expansion
1 x Low Speed CMI Interface for optional CMI Module Expansion
1 x CFM IGN Interface for optional CFM-IGN Module Expansion
Memory Slots
2 x SODIMM
Memory Speed
4800 MHz
Power Interface
Connector Type: 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A