IMB-1231

IMB-1231 View Larger Image

Intel® 12th Gen (Alder Lake-S) Core™ Processors with Q670 chipset, 2 x 260-pin SO-DIMM DDR4 3200 MHz , up to 64GB (32GB per DIMM), 1 x PCIe x16 (Gen4), 4 x USB 3.2 Gen2, 2 x USB 3.2 Gen1, 4 x USB 2.0, 1 x M.2 Key B, 1 x M.2 Key E, 2 x M.2 Key M, 5 x COM, 4 x SATA3, 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 2 x DP1.4a, 1 x LVDS or eDP, 1 x VGA, TPM 2.0 onboard IC, Supports Intel® vPro, AMT, VMD RAID 0/1/5/10, ATX-PWR (24+4-pin) and +12V DC-In co-design

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    Specifications

    Chipset

    Q670 chipset

    Dimensions

    170mm (6.7”) x 170mm (6.7”)

    Expansion

    1 x PCIe x16 (Gen4)
    1 x M.2 (Key E, 2230) with PCIe x1, USB 2.0 and CNVi for Wireless
    1 x M.2 (Key B, 3042/3052) with PCIe x1/USB3.2 Gen1/USB 2.0 and SIM for 4G
    SIM: 1 x Socket connected to M.2 Key B

    Graphics

    Intel® UHD Graphics
    HDMI 2.0b: Max resolution up to 4096x2160@60Hz
    DisplayPort 1.4a, DP++: Max resolution up to 4096x2160@60Hz
    VGA: Max resolution up to 1920 x 1200@60Hz
    LVDS: Dual channel 24 bit up to 1920x1200@60Hz
    eDP: Max resolution up to 1920 x 1200@60Hz
    MultiDisplay: Triple Display

    Input Voltage

    ATX PWR (24+4-pin) and +12V DC-In c o-design

    LAN Controller

    LAN1: Intel® I225LM with 10/100/1000/2500 Mbps, support AMT/vPro
    LAN2: Intel® I225LM with 10/100/1000/2500 Mbps

    Memory Capacity

    64GB (32GB per DIMM)

    Memory Slots

    2 x 260-pin SO-DIMM

    Memory Speed

    3200 MHz

    Memory Type

    DDR4

    Onboard I/O

    2 x USB 3.2 Gen1 (1 x USB 3.2 header)
    4 x USB 2.0 (2 x 2.54 pitch header)
    3 x COM(RS-232)
    4 x GPI, 4 x GPO
    TPM 2.0 onboard IC
    1 x LVDS
    1 x eDP
    1 x SATA PWR Output
    1 x Speaker Header

    Operating Temp

    0~60°C

    Power Interface

    ATX PWR (24+4-pin) and +12V DC-In c o-design
    AT/ATX Supported
    - AT : Directly PWR on as po wer input ready
    - ATX : Press button to PWR on after po wer input ready

    Processor

    Intel® 12th Gen (Alder Lake-S) Core™ Processors, up to 65W

    Processor Generation

    Alder Lake

    Processor Socket Type

    LGA1700

    Rear I/O

    4 x USB 3.2 (Gen2)
    2 x COM(RS-232/422/485)
    2 x 2.5 Gigabit LAN
    2 (Mic-in, Line-out)
    1 x HDMI 2.0b
    2 x DP 1.4a++
    1 x VGA

    SKU

    IMB-1231

    Storage

    1 x M.2 (Key M, 2242/2260/2280) with PCIe Gen3 x4 for SSD
    4 x SATA3 (6Gb/s)

    Storage Temp

    -40°C~85°C