COM Express Compact Type 6, Intel® Tiger Lake UP3 high performing and low power Intel® Core™ processor, Embedded/Industrial use condition, Extended temperature options available, PCI Express Gen 4, Integrated high performance Xe (Gen 12) graphics with 96 EU, AI/DL Instruction Sets including VNNI
conga TC570
Specifications
Dimensions
95 x 95 mm (3.74” x 3.74”)
Expansion
8x PCIe Gen3
PEG support x4 (PCIe Gen4)
1 x SPI interface
Graphics
Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units)
Supporting 4 independent display units (4x 4k/2x 8K)
Enhanced media (AV1/12b) with up to 2 Vdbox
Next Gen IPU6 with DPHY2.1 | HDMI 2.0/2.1 | DP 1.4
3x DP/HDMI/DP++ | eDP/LVDS | VGA (optional)
LAN Controller
1x 2,5GbE TSN Ethernet via Intel® i225
Memory Capacity
max. 32GB
Memory Slots
2 SO-DIMM
Memory Speed
3200 MT s
Memory Type
DIMM sockets for DDR4 memory modules up to 32
Onboard I/O
4x USB 3.1 Gen 2
8x USB 2.0
2x UART
8x GPIO
Operating Temp
-40°C ~ +85°C
Processor
General Embedded Versions
Intel® Core™ i7 1185G7E Processor
Intel® Core™ i5 1145G7E Processor
Intel® Core™ i3 1115G4E Processor
Industrial Versions
Intel® Core™ i7 1185GRE Processor
Intel® Core™ i5 1145GRE Processor
Intel® Core™ i3 1115GRE Processor
Processor Generation
Tiger Lake
SKU
conga-TC570
Storage
2x SATA III (6Gb/s)
UFS 2.0 onboard flash up to 64 Gbyte
Processor Socket Type
BGA
Chipset
SoC
Power Interface
ACPI 5.0 with battery support