Intel® Elkhart Lake SoC Processors, 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 32GB(16GB per DIMM), 1 x USB 3.2 Gen2, 1 x USB 3.2 Gen1, 6 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 1 x SATA3, 2 x Intel 2.5 Gigabit LAN, Support Triple display, 1 x LVDS or eDP, 1 x HDMI2.0b, 1 x VGA, TPM 2.0 onboard IC, 9~36V DC-In
SBC-250D
Specifications
Chipset
SoC
Dimensions
5.8-in x 4-in x 0.87-in (14.7 cm x 10.2 cm x 2.20 cm)
Expansion
1 x M.2 (Key B, 3042/3052) with PCIex1/USB3.2 and USB2.0 and SIM for 4G/5G
1 x M.2 (Key E, 2230) with PCIe x1 and USB 2.0 for Wireless
1x SIM socket connected to M.2 key B
Graphics
Intel® Gen 11 Graphics
HDMI 2.0b: Max resolution up to 4096 x 2160@60Hz
VGA: Max resolution up to 1920 x 1200
LVDS: Dual channel 24 bit up to 1920 x 1200@60Hz (Connector shared with eDP)
eDP: Max resolution up to 1920 x 1080@60Hz (Connector shared with LVDS)
Triple display
Input Voltage
9~36V DC-In
LAN Controller
LAN1: Intel® I225LM with 10/100/1000/2500 Mbps
LAN2: Intel® I225LM with 10/100/1000/2500 Mbps
Memory Capacity
up to 32GB
Memory Slots
2 x SODIMM
Memory Speed
3200 MHz
Memory Type
DDR4
Onboard I/O
1 x USB 3.2 Gen1 (1 x USB 3.1 header )
1 x USB 2.0 (1 x USB 3.1 header)
4 x USB 2.0 (2 x 2.54 pitch header)
COM1, COM2, COM4 (RS-232)
COM3 (RS-232/422/485)
4 x GPI, 4 x GPO
1 (Connector with LVDS/eDP signal, switch by BIOS)
LVDS: 1 (Connector with LVDS/eDP signal, switch by BIOS)
TPM 2.0 onboard IC
1 SATA PWR Output
1 Speaker Header
Operating Temp
0~70°C
Power Interface
4-pin wafer PWR
Processor
SBC-250D (J6426, QC, Max Speed Up to 3.0GHz, 10W)
Processor Generation
Elkhart Lake
Processor Socket Type
BGA
Rear I/O
1 x USB 3.2 Gen2
1 x USB 2.0
2 x 2.5 Gigabit LAN
1 x VGA
1 x HDMI2.0b
SKU
SBC-250D
Storage
1 x M.2 (Key M, 3042/3060/2280) with PCIe x1 for SSD
1 x SATA 3
Storage Temp
-40°C~85°C