Robust RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor, 1 COM, 1 CAN Bus, 2 LANs and DIO (2-IN/1-OUT)
IFB112
Specifications
Certifications
FCC Part 15
Heavy Industrial CE
Dimensions
31 mm (1.22") (W) x 100 mm (3.94") (D) x 125 mm (4.92") (H)
Expansion
1 x PCI Express Mini Card socket
1 x SIM card socket
Front I/O
Top I/O:
1 x DIO (2-IN/1-OUT) DI: Wet/Dry
DO: Wet
DI:
Input channels: 2 source type
Input voltage: 0 to 24 VDC digital input levels for dry contacts:
-Logic level 0: close to GND
-Logic level 1: open
Digital input levels for wet contacts :
-Logic level 0: Close to GND
-Logic level 1: +0.7 ~ +24 V max
DO:
Output channels: 1, sink type
Output current: max. 200 mA per channel
On-state voltage: 24 VDC nominal, open
1 x Relay
1 x Console
Front I/O:
1 x RS-232/422/485 (RS-232/422/485 interface select by Software)
1 x CAN 2.0 B (DB9 connector) Meets ISO 11898 standard Software control termination resistor 120 ohm can high speed up to 1Mbit/s for transmit/receive
2 x 10/100 Mbps Ethernet Magnetic isolation protection 1.5KV
Input Voltage
9 ~ 48VDC power input range
LAN Controller
2 x 10/100 Mbps Ethernet Magnetic isolation protection 1.5KV
Memory Capacity
256MB
Memory Slots
onboard
Memory Speed
1600 MHz
Memory Type
DDR3
Mounting Options
DIN-rail, wall mounting
Operating Temp
-40°C~70°C
Power Interface
Power input with terminal block
Processor
Freescale i.MX 6UL processor, ARM® Cortex®-A7, 528 MHz
Rear I/O
Bottom I/O:
1 x USB 2.0
2 x Antenna
1 x Power input with terminal block
SKU
IFB112
Storage
1 x eMMC 4GB flash onboard
1 x EEPPROM (2 Kb)