ICES 670 - Nexcom
Features
Intel® 4th generation Core™ processor,Mobile Intel® QM87 chipset, Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs, Support Dual channel ECC-DDR3L/ SO-DIMMs 1333/1600MHz up to 16GB, Support PCIe x16, 7x PCIe x 1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/2x SATA2.0, GbE,Up to 3x independent displays, VGA, eDP/ LVDS, DVI, HDMI, DisplayPort, Dimension 95 x 125mm2 (W x L)
| Product Specifications | ||||||
|---|---|---|---|---|---|---|
| CPU | Support Intel® BGA 1364, 4th generation Intel® Core™ processors (Haswell-M/ Shark Bay-MB) | |||||
| Chipset | Mobile Intel® QM87 chipset | |||||
| Memory | Dual ECC-DDR3L/ SO-DIMMs, support 1333/1600MHz memory up to 16GB | |||||
| Video | Intel® GT1/ GT2/ GT3 integrated graphics processing unit (iGPU) One PCI Express x16 (Gen. 3.0) Lane down to the carried board Supports VGA and eDP/ LVDS interface 3x DDI (Digital Display Interface) supports HDMI/ DVI, DP/ eDP interfaces | |||||
| LAN | Intel® Clarkville(I217) Gigabit Ethernet, support next generation vPro/iAMT Support PXE boot from LAN, wake on LAN function Signals down to I/O board | |||||
| I/O Ports | AB VGA LVDS 8x USB2.0 HD Audio 4x SATA GbE GPIO LPC bus 1x PCIe x4 3x PCIe x1 SMBus (I2C) SPI BIOS SPK out cd PCIex16 3x DDI 4x USB 3.0 | |||||
| Storage Interface | 2x SATA3.0 2x SATA2.0 | |||||
| Audio | HD audio interface | |||||
| Expansion Interface | 1x PCIe x4 3x PCIe x1 PCIex16/ | |||||
| Power Requirement | +12V, +5VSB, +3.3V RTC power | |||||
| Operating Temperature | -15°C to 60°C | |||||
| Other Info | n/a | |||||
| To contact us click here or call 905-265-1235 | ||||||
