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ICES 670 - Nexcom

Features

Intel® 4th generation Core™ processor,ŒMobile Intel® QM87 chipset, Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs, Support Dual channel ECC-DDR3L/ SO-DIMMs 1333/1600MHz up to 16GB, Support PCIe x16, 7x PCIe x 1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/2x SATA2.0, GbE,ŒUp to 3x independent displays, VGA, eDP/ LVDS, DVI, HDMI, DisplayPort, Dimension 95 x 125mm2 (W x L)

Product Specifications
CPUSupport Intel® BGA 1364, 4th generation Intel® Core™ processors (Haswell-M/ Shark Bay-MB)
ChipsetMobile Intel® QM87 chipset
MemoryDual ECC-DDR3L/ SO-DIMMs, support 1333/1600MHz memory up to 16GB
VideoIntel® GT1/ GT2/ GT3 integrated graphics processing unit (iGPU)
One PCI Express x16 (Gen. 3.0) Lane down to the carried board
Supports VGA and eDP/ LVDS interface
3x DDI (Digital Display Interface) supports HDMI/ DVI, DP/ eDP interfaces
LANIntel® Clarkville(I217) Gigabit Ethernet, support next generation vPro/iAMT
Support PXE boot from LAN, wake on LAN function
Signals down to I/O board
I/O PortsAB
VGA
LVDS
8x USB2.0
HD Audio
4x SATA
GbE
GPIO
LPC bus
1x PCIe x4
3x PCIe x1
SMBus (I2C)
SPI BIOS
SPK out

cd
PCIex16
3x DDI
4x USB 3.0
Storage Interface2x SATA3.0
2x SATA2.0
AudioHD audio interface
Expansion Interface1x PCIe x4
3x PCIe x1
PCIex16/
Power Requirement+12V, +5VSB, +3.3V RTC power
Operating Temperature-15°C to 60°C
Other Infon/a
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