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ICES 668 - Nexcom


Embedded Intel® 3rd generation Core™ i7/ i5/ i3 processor, Ivy Bridge Mbl + ECC, Intel® QM77 PCH chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs, Support Dual channel DDR3 with ECC SO-DIMMs 1333/1600MHz up to 16GB, Support PCIe x16, 7x PCIe x1, 4x USB3.0/ 8x USB 2.0, 2x SATA 3.0/, 2x SATA 2.0 and GbE, Up to 3x Independent Displays, VGA, Dual Channels 18/24-bit LVDS, DVI, HDMI, DisplayPort, Dimension 95mm (W) x 125mm (L)

Product Specifications
CPUSupport Intel® BGA 1023, 3rd generation Intel® Core™ processor
–– Intel® Core™ i7 3615QE (4C/ 6M cache/ 2.3GHz/ Max. TDP 45W)
–– Intel® Core™ i7 3555LE (2C/ 4M cache/ 2.5GHz/ Max. TDP 25W)
–– Intel® Core™ i7 3517UE (2C/ 4M cache/ 1.7GHz/ Max. TDP 17W)
–– Intel® Core™ i3 3217UE (2C/ 3M cache/ 1.6GHz/ Max. TDP 17W)
–– Intel® Core™ i5 3610ME (2C/ 3M cache/ 2.7GHz/ Max. TDP 35W)
ChipsetIntel® QM77 PCH chipset
MemoryDual DDR3/ SO-DIMMs, support 1333/1600MHz ECC system memory up to 16GB
VideoSupports VGA
Single/dual channel s 18/24 bit LVDS interface
3x DDI (Digital Display Interface) supports HDMI/ DVI, DisplayPort and SVDO interfaces
LANIntel® 82579LM Gigabit Ethernet, support iAMT 8.0
Support PXE boot from LAN, wake on LAN function
Signals down to I/O board
I/O PortsCOM Express Connector
8x USB 2.0
2x Serial Port
LPC bus
1x PCIe X4
3x PCIe X1

PCIe x16
3x DDI
4x USB 3.0
Storage Interface4x SATA
AudioHD audio interface
Expansion Interface1x PCIe X4
3x PCIe X1
PCIe x16
Power Requirement+12V, +5VSB, +3.3V RTC power
Operating TemperatureBoard level operating temperatures: 0°C to 60°
Other InfoThe ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel® QM77 PCH chipset supports Intel® 3rd generation Intel® Core™ processor with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/ 1600MHz SDRAM with ECC support. The ICES 668 integrated Intel® HD graphics with DX11 support or expands via PCI Express Graphic 1x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO and legacy VGA, 18/24 bits LVDS interface. The high performance ICES 668 COM Express Basic Module supports 4x USB 3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and 7x PCIe x 1 lanes through our NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ ODM projects.
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