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ICES 667 - Nexcom


3rd generation Intel® Embedded Core™ rPGA988 embedded processors family, Intel® QM77 PCH (HM76 ) chipset support PICMG COM.0 Rev. 2.0, Type 6 pin-outs, Support two DDR3 SO-DIMMs 1333/ 1600 non-ECC up to 16GB, Support PCIex16 (Gen3.0) 7x PCIEx1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE, Up to 3x DDI (DP/ HDMI/ DVI) multiple displays, VGA, dual channels 18/ 24-bit LVDS, Dimension: 95mm (W) x 125mm (L)

Product Specifications
CPUSupport 3rd generation Intel® Core™ i7/ i5/ i3 embedded rPGA988 processors
–– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)
–– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)
–– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
ChipsetIntel® QM77 PCH chipset
MemoryTwo DDR3 SO-DIMMs, 1333/ 1600 MHz SDRAM non-ECC up to 16GB
VideoSupports VGA
Single/dual channel s 18/24 bit LVDS interface
3x DDI (Digital Display Interface) supports HDMI/ DVI, DisplayPort and SVDO interfaces
LANIntel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported with QM77 only)
Support boot from LAN, wake on LAN function
Signals down to I/O board
I/O PortsCom Express Connector
8x USB 2.0
HD Audio
4x SATA2.0
3.0, GbE
LPC bus
1x PCIe x4
2x PCIe x1
SMBus (I2C)
SPK out

PCIe x16(Gen. 3.0)
3x DDI
4x USB 3.0
PCIe x1
Storage Interface4x SATA2.0/ 3.0
AudioHD audio interface
Expansion Interface1x PCIe x4
2x PCIe x1
ΠCD PCIe x16(Gen. 3.0
Power Requirement+12V, +5VSB, +3.3V RTC power
Operating Temperature-15°C to 60°C
Other InfoThe ICES 667 is a Type 6 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports 3rd generation Intel® Core™ i7/ i5/ i3 rPGA988 embedded processors up to i7-3610QE (4x 2.3Ghz/ max.TDP 45W) with two DDR3 SO-DIMMs 1333/ 1600MHz non-ECC up to 16GB. The 3rd Generation Intel® Core™ i7/ i5/ i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The Three DDI interfaces allows ICES 667 implement HDMI, DVI, Display Port, SDVO on Customer Solution Board besides VGA, LVDS interface. The high performance ICES 667 COM Express Module supports 4x SATA2.0/ 3.0, 12x USB 2.0/ 3.0 and 7x PCIe x 1 lanes through the carrier board; NEXCOM is offering standard Type 6 carrier board, ICEB 8060 to help device makers and equipment builders to evaluate full set of I/O function and add-on cards at early development stage.
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